NST 分类测试机
简单而智能

NS Technologies

NS Technologies 是日本商社兼松株式会社(Kanematsu Corporation)创立的全资子公司，接受了与爱普生 IC 测试处理机业务相关的所有资产的转让，并将继续作为专业制造商经营该业务。 我们保留了日本和海外的生产与销售体系，构建了一套提供与之前相同服务的系统。

NX1032XS IC Test Handler

支持全球半导体产业，供高速且稳定运作的IC测试处理机

IC Handler
  • Up to 32 site testing capability
  • Testing area from 344mm x 244mm
  • Up to 480kgf contact force
  • UPH - up to 20,000 (Ambient)
  • Up to 10,500 (High Temperature)

Developed using leading-edge robot technology, this IC test handler boasts significantly improved performance to support even the most demanding tests.

规格介绍

NX1032XS
Devices Handled 16-site 32-site
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA,
Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) *1
Test Mode N/A 32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch)
8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm)
4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm)
2-site (Socket pitch 80 mm)
Single (use one side of the 2-site test)
Non-standard pitches can be set by laying out the independent compliance unit with desired pitches
Testing Area 344 × 146 mm 344 × 244 mm
Standard Socket Pitch (mm) X: 40mm Y: 60mm
Heating Method Heat Press Method
Index Time *2
(common in Ambient and High Temperature modes)		 Min. 0.38sec
Approx. 0.42sec. (wide 4×2, 8×2 layout) Approx. 2.05sec. (8×4 layout)
Approx. 2.21sec. (4,800N Option) Approx. 4.35sec. (4,800N Option)
Max. Contact Force 1,600N (Optional) or 4,800N (Standard) 3,200N (Optional) or 4,800N (Standard)
Maximum Throughput (units per hour) 8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000(ambient temperature)
8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray JEDEC (135.9 × 315.0 mm)
Temperature Accuracy +50°C to +90°C ±2°C
+90°C to 155°C ±3°C
Hot Plate Size 220mm × 380 mm *3
Power Requirement Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,580(W) x 1,940(D) x 2,000(H) *4
Weight Approx. 1,200kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.

NS8080SH / NS8040SH IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

IC Handler
  • Up to 4/8 sites testing capability
  • Testing area from 184mm x 149mm
  • Up to 120kgf contact force
  • UPH - up to 13,500 (ambient)
  • Up to 8,200 (High Temperature)

规格介绍

NS8160MS NS8080MS NS8080SH NS8040SH
Devices Handled QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1
Test Mode 16-site (8 x 2)
 N/A N/A N/A
8-site (4 x 2) N/A
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single
Testing Area 264 mm x 149 mm 184 mm x 149 mm
Standard Socket Pitch (mm) X: 30 Y: 60(max X: 30 Y: 63.5) X: 40 Y: 60(max X: 60 Y: 63.5) X: 40 Y: 60 X: 80 Y: 60
Heating Method Heating Plate
Index Time 0.42 sec (up to 160 kgf)*2 0.4 sec (up to 120 kgf)*2
0.58 sec (up to 240 kgf)*2 N/A
Maximum Throughput (units per hour)
 13,500 units(ambient temperature)
8,200 units(high temperature)		 10,000 units(ambient Temperature)
6,100 units(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray Size JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure 240 kgf 120 kgf
Temperature Accuracy +50°C to +90°C ±2°C *4
+90°C to +155°C ±3°C *4		 +50°C to +90°C ±2°C
+90°C to +130°C ±3°C
Power Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,850(W) x 1,500(D) x 1,970(H) *3 1,850(W) x 1,500(D) x 1,850(H) *3
Weight Approx. 1,090kg Approx. 1,000kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.

NS8160MS / NS8080MS IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

IC Handler
  • Up to 4/8 sites testing capability
  • Testing area from 184mm x 149mm
  • Up to 120kgf contact force
  • UPH - up to 13,500 (ambient)
  • Up to 8,200 (High Temperature)

规格介绍

NS8160MS NS8080MS NS8080SH NS8040SH
Devices Handled QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1
Test Mode 16-site (8 x 2)
 N/A N/A N/A
8-site (4 x 2) N/A
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single
Testing Area 264 mm x 149 mm 184 mm x 149 mm
Standard Socket Pitch (mm) X: 30 Y: 60(max X: 30 Y: 63.5) X: 40 Y: 60(max X: 60 Y: 63.5) X: 40 Y: 60 X: 80 Y: 60
Heating Method Heating Plate
Index Time 0.42 sec (up to 160 kgf)*2 0.4 sec (up to 120 kgf)*2
0.58 sec (up to 240 kgf)*2 N/A
Maximum Throughput (units per hour)
 13,500 units(ambient temperature)
8,200 units(high temperature)		 10,000 units(ambient Temperature)
6,100 units(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray Size JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure 240 kgf 120 kgf
Temperature Accuracy +50°C to +90°C ±2°C *4
+90°C to +155°C ±3°C *4		 +50°C to +90°C ±2°C
+90°C to +130°C ±3°C
Power Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,850(W) x 1,500(D) x 1,970(H) *3 1,850(W) x 1,500(D) x 1,850(H) *3
Weight Approx. 1,090kg Approx. 1,000kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.
NST分类测试机
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